Esko, alongside sister companies Pantone, X-Rite and AVT released a new study, “Packaging and the Digital Shopper: Meeting Expectations in Food & Beverage,” highlighting what primary shoppers want from food and beverage packaging. Brand and marketing managers, design leaders, packaging professionals and tech leaders gain knowledge of shopper’s preferences in packaging within the food and beverage category in this study, along with the how and why they buy. With this knowledge they can better optimize, evolve and connect packaging through technology platforms that support end-to-end packaging value chain and leverage packaging as an enabler for product innovation.

As a leading global supplier of smart automation solutions, BÖWE SYSTEC is active in many industries. For decades, banks, insurers and telecommunication companies have relied on BÖWE SYSTEC systems to totally fulfill their security requirements. Now, with a unique development for the serialization and decommissioning of medicines, the Augsburg manufacturer is applying its extensive Track & Trace know-how to the pharmaceutical industry. Its new serialization solution will have its debut on the BÖWE SYSTEC booth at ACHEMA 2018 from June 11 to 15 in Frankfurt am Main (Hall 1.1, Booth E14).

67 Winners Announced Last Night in Boston
Last night, the 9th annual Dieline Awards were held in Downtown Boston at the Hynes Convention Center. With over 1400 entries from all over the world, 68 winners across a wide spectrum of categories were recognized.

Trends in the packaging industry and the increasingly rapid changes in consumer behaviour were the overriding themes at the 5th Packaging Inspiration Forum, held by the PrintCity Alliance in Hamburg on 26 and 27 February 2018. The one-and-a-half days of the event offered an ideal opportunity for further discussion of the presentations, breakout and panel sessions. The event achieved 150 visitors, a record number. As in previous years, the Grand Elysée Hotel was the ideal venue.

Trends in the packaging industry and consumer behaviour

All companies offering technologies and integrated solutions for the food and beverage industries with their sights on the US market are now able to register for PROCESS EXPO 2019. Forming part of the interpack alliance the US event will be held at the McCormick Place exhibition centre in Chicago from 8 to 11 October. Registrations will be accepted on a first come, first served basis – so interested companies should not wait for too long – all the more as a large proportion of the exhibition space has already been allocated to members of the organising Food Processing Suppliers Association (FPSA) as well as existing exhibitors in the run-up. At, interested firms can check out the stand places still available on a hall plan.